JCR(Junction Coating Resin)
JEDEC(Joint Electron Device Engineering Council)
¹ÝµµÃ¼ Á¦Ç°ÀÇ Pin ¹× Package µîÀÇ Á¦Ç°¼³°è spec.À» Á¤ÇÏ´Â À§¿øÈ¸.
¹Ì±¹ EIA(Electronic Industries Association)ÀÇ »êÇϱâ°üÀÌ¸ç ¹Ì±¹ÀÇ ÀüÀÚ¾÷ü ¹× ¹ÝµµÃ¼ ¸ÞÀÌÄ¿·Î Á¶Á÷
µÇ¾î ÀÖ´Â ´Üü·Î¼ ¾÷°è ǰÁ¾À» °áÁ¤ÇÑ´Ù.
JEIDA(Japan Electronic Industry Developement Association) ÀϺ» ÀüÀÚ°ø¾÷Ç¥ÁØ Çùȸ.
JESSI(Joint European Submicron Silicon Initiative)
J-FET(Junction FET)
Depletion Mode¸¸À» »ç¿ëÇϸç Source-Drain ¿µ¿ª»çÀÌ¿¡ IonÁÖÀÔ È¤Àº È®»ê °øÁ¤¿¡ ÀÇÇÑ GateÀü±ØÀ»
¸¸µé°í Gate¿¡ °É¾îÁÖ´Â Àü¾Ð¿¡ ÀÇÇÑ Drain Àü·ù¸¦ Á¦¾îÇÏ´Â FET(Field Effect Transistor)¸¦ ÀÏÄÃÀ½.
Jig
Á¦Ç°º°·Î °Ë»ç ¶Ç´Â ÀÛ¾÷À» Çϱâ À§ÇØ Á¶»ç ¹× ÀÛ¾÷ Á¶°Çȯ°æ¿¡ ¸Â°Ô ¸¸µé¾î ÁÖ´Â ÀåÄ¡À̸ç Á¦Ç°°ú
°Ë»ç Àåºñ°£¿¡ ¿¬°á±â´ÉÀ» °¡Áü.
JIS(Japan Industrial Standard)
ÀϺ»°ø¾÷±Ô°Ý.ÇÕ°Ýǰ¿¡´Â JIS ¸¶Å©°¡ ºÙ¿©Áø´Ù.
1980³âºÎÅÍ ¿Ü±¹Á¦Ç°¿¡ JIS ¸¶Å©¸¦ ÀÎÁ¤Å°·Î Çß´Ù.
JIT(Just In Time)
»ý»ê½ÃÁ¡°ú ±¸¸Å½ÃÁ¡¿¡¼ÀÇ ºÎǰ Çʿ䷮À» ÀÏÄ¡½ÃÄÑ Àç°í¸¦ ÃÖ¼ÒÈÇϱâ À§ÇÑ Àç°í ¹× »ý»ê°ü¸®½Ã½ºÅÛ.
JPEG(Joint Picture coding Experts Group) Á¤ÁöÈ»óó¸® ±¹Á¦Ç¥ÁؽºÆåÀ» Á¤ÇÏ´Â ±¹Á¦ ´Üü.
Junction ÇϳªÀÇ ´Ü °áÁ¤¼Ó¿¡ ¹°¸®Àû Ư¼ºÀÌ ´Ù¸¥ ºÎºÐÀÇ Á¢ÇÕ¸éÀ» JUNCTIONÀ̶ó°í ÇÑ´Ù.
Junction Depth(Xj)
Silicon Ç¥¸é¿¡¼ºÎÅÍ Diffused LayerÀÇ ³óµµ°¡ Background ³óµµ¿Í °°Àº ÁöÁ¡±îÁöÀÇ °Å¸®¸¦ ¸»ÇÑ´Ù.
Junction Diode PNÁ¢ÇÕÀ» ÀÌ¿ëÇÑ Diode.
Junction Transistor(Á¢ÇÕÇü TR) 3Ãþ ±¸Á¶(PNP ¶Ç´Â NPN)À¸·Î µÈ TR.
Junction spiking Metal-Silicon contact¿¡¼ MetalÀÌ SiliconÀ» ÆÄ°í µé¾î°¡´Â Çö»óÀ» ¸»ÇÔ.
Jungle-Box
È®»ê·Î ³»·Î ÇÊ¿äÇÑ Gas¸¦ ÇÊ¿äÇÑ ¾ç¸¸Å ÁÖÀÔ½Ã۱â À§ÇÏ¿© Gas Flow meter(MFC)°¡ ºÎÂøµÇ¾î ÀÖ¾î
Gas·®À» Á¶ÀýÇÒ ¼ö ÀÖµµ·Ï ÇÑ °Í.
K
Kerf Àý´Ü ÀÚ±¹(ÈçÀû). Blade·Î Àý´ÜÇÏ¿´À» ¶§ Àý´ÜµÈ ÀÚ±¹ÀÇ ÆøÀ» ÀǹÌ.
Keying Slot Àμâ±âÆÇÀÌ ÇØ´çÀåºñ¿¡¸¸ »ðÀÔµÇ°í ±âŸÀÇ Àåºñ¿¡´Â »ðÀ﵃ ¼ö ¾øµµ·Ï °í¾ÈµÈ ½½·Ô.
Know-How ¾î¶² »ç¶÷ÀÌ ±×°¡ °¡Áö°í ÀÖ´Â ±â¼úÀ» ÃÖ°íÀÇ Á¶°ÇÇÏ¿¡¼ ½Ç½ÃÇϴµ¥ ÇÊ¿ä·Î ÇÏ´Â Áö½Ä.
KS(Korean Standard) °ø¾÷Ç¥ÁØÈ¸¦ À§ÇØ Á¦Á¤µÈ °ø¾÷±Ô°Ý.
Kurtosis
ºÐÆ÷ÀÇ »ÏÁ·ÇÑ Á¤µµ. ¥ã2°¡ ¾çÀÌ¸é ºÐÆ÷´Â Á¤±ÔºÐÆ÷º¸´Ù ´õ ±ä²¿¸®¸¦ °®°í ¹Ý´ë·Î À½À̸é Á¤±ÔºÐÆ÷º¸´Ù
ªÀº ²¿¸®¸¦ °®´Â´Ù.
Á¤±ÔºÐÆ÷¿¡¼ ¥ã2=0ÀÌ´Ù.
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